Process Engineering Intern - Summer 2027

Corning
Town of Canton, New York, United StatesPosted Sep 2, 2026
Hardware / EngineeringSummer 2027

About the role

Requisition Number: 77361

The company built on breakthroughs. ​ Join us.​

Corning is one of the world’s leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space, our technologies push the boundaries of what’s possible. ​

How do we do this? With our people. They break through limitations and expectations – not once in a career, but every day. They help move our company, and the world, forward. ​

​At Corning, there are endless possibilities for making an impact. You can help connect the unconnected, drive the future of automobiles, transform at-home entertainment, and ensure the delivery of lifesaving medicines. And so much more.​

​Come break through with us. The Specialty Materials segment manufactures products that provide more than 150 material formulations for glass, glass ceramics and fluoride crystals to meet demand for unique customer needs. Consequently, this segment operates in a wide variety of commercial and industrial markets that include display optics and components, semiconductor optics components, aerospace and defense, astronomy, ophthalmic products, telecommunications components and cover glass that is optimized for portable display devices. Role Purpose Corning is seeking a Process Engineering Intern to join our team in Canton, New York for Summer 2027. This full-time, onsite internship offers a unique opportunity to work at the intersection of advanced materials, manufacturing, and process innovation.

At Corning, our technologies help shape the world. From advanced glass and ceramics to critical materials solutions, we enable breakthrough applications across industries including semiconductor, aerospace, and defense. As a Process Engineering Intern, you will work directly with experienced engineers and plant teams to support manufacturing performance, improve process capability, and c

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