Intern - AI Hardware and Memory Systems

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The HBM Architecture team is at the forefront of developing next-generation memory solutions that enable advances in artificial intelligence, high-performance computing, and data-intensive applications. The team researches and evaluates innovative memory and system architecture concepts, working across disciplines to optimize performance, power efficiency, and scalability for future computing platforms. Join a collaborative environment where innovative research is transformed into technologies that shape the future of AI infrastructure. As a PhD Intern on the HBM Architecture team, you will research and prototype advanced memory and system architecture concepts for next-generation AI accelerators. You will develop performance models, analyze AI workloads, and evaluate how memory hierarchy and interconnect design choices impact system performance, power efficiency, and scalability. This role offers the opportunity to collaborate with experienced architects and engineers while contributing to the future of AI computing systems.

Responsibilities

Research and evaluate advanced memory and system architecture concepts for AI accelerators, including GPUs, TPUs, and custom accelerator designs. Develop and analyze performance models to assess bandwidth, latency, power, scalability, and overall system efficiency. Analyze AI training, inference, and HPC workloads to identify memory and system performance bottlenecks. Investigate memory hierarchy, HBM, DRAM, cache, storage, and interconnect optimizations to improve system performance. Collaborate with cross-functional engineering teams and e