Intern - Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, our HBM (High Bandwidth Memory) Engineering team develops advanced memory solutions that enable next-generation Artificial Intelligence (AI), machine learning, and high-performance computing applications. The team collaborates across global design, verification, and product engineering organizations to deliver innovative semiconductor technologies that power data centers and intelligent systems worldwide. As an HBM Design Engineer Intern, you will work alongside experienced engineers to support the development and verification of industry-leading HBM products. This role provides hands-on exposure to advanced design verification methodologies, simulation environments, debugging techniques, and AI-driven computing technologies. You will contribute to real product development efforts while building foundational skills in semiconductor design and verification.

Responsibilities

Support the verification of HBM designs by developing and performing simulation test plans to validate functionality, performance, and timing requirements. Analyze design specifications and assist in creating verification strategies using industry-standard design and verification methodologies. Debug design and verification issues in collaboration with design, verification, and validation engineers. Use hardware description languages and verification tools to develop, enhance, and maintain verification environments. Collaborate with global engineering teams developing memory solutions that support Artificial Intelligence (AI), machine learning, and advanced computing applications.

Minimum Qualifications

Currently pursuing a Bachelor's or Master's degree in Electrical Engineering