Packaging Engineering Intern

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available.

Qorvo’s Internship Program offers

Challenging, skill-building assignments Mentoring and coaching from industry experts Launch & Learns and other learning opportunities Collaborative team-based work environment Networking and social events Final presentation to business leaders

Qorvo’s Packaging Engineering Internships are offered in our Global Operations business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities may include

Gain knowledge on Back Grinding, Dicing, and DTR Processes to assist with R&D and continuous improvement initiatives. Contribute to the advancement of the DTR image analysis with a programming initiative. Characterize the small R&D products and processes (tooling, films, DTR pocket tapes, etc.) using solid modeling and laser metrology to enhance the process. Onsite hands-on learning of semiconductor assembly processes Other minor activities related to documentation and continuous improvement (A3s and Lean)

Qualifications

BS in Mechanical, Chemical, Electrical Engineering Communication and