Packaging Engineering Intern - Summer

About fab2 The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.

We're looking for exceptional, hands-on people who can iterate to the limits of what's possible. fab2 was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.

About the Role

We’re hiring Semiconductor Packaging Engineering Interns for the summer term. The internship begins in May or June, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology. Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here.

Responsibilities

Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics Collaborate with cross-functional teams to continuously improve fabrication processes and equipment Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology) Required Exper