Module Engineering PhD Intern 2027

Job Details

Job Description

As a Module Engineering Intern within Intel's F25 Metals organization, you will work alongside engineers, technicians, and operations teams to support High Volume Manufacturing (HVM) of Intel's leading-edge semiconductor technologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while contributing to real-world engineering and operational challenges. Interns will own and execute a meaningful project focused on areas such as process improvement, manufacturing efficiency, equipment performance, automation, data analytics, quality systems, or operational excellence. In addition to their primary project, interns will participate in day-to-day engineering activities and engage with cross-functional stakeholders to gain a broad understanding of semiconductor manufacturing operations. Throughout the internship, you will learn how engineering decisions are made in a high-volume manufacturing environment by observing manufacturing workflows, analyzing data, identifying improvement opportunities, and communicating recommendations to technical and business partners. Interns are encouraged to explore multiple aspects of the organization through networking, mentorship, training, and collaboration across engineering disciplines.

This internship provides opportunities to

Lead a project from problem definition through execution and final presentation Analyze manufacturing, equipment, and operational data to support decision making Apply structured problem-solving and continuous improvement methodologies Collaborate with engineers, technicians, quality teams, and operational stakeholders Develop technical communication and presentation skills Gain exposure to advanced semiconductor manufacturing technologies and operations Successful candidates will demonstrate curiosity, initiative, strong problem-solving abilities, and a desire to learn in a fast-paced manufacturing environment. This role